Resin Bond Diamond Dicing Blades are used for precision dicing of a wide range of materials, including semiconductor materials, ceramics, quartz, sapphire, and hard brittle materials. They are designed for high-speed dicing with minimal chipping and burr formation. The blades are made of high-quality diamond particles that are bonded with a resin matrix. They allow for a superior cutting performance and longer blade life. They Resin Bond Diamond Dicing Blades are also available in different grit sizes to provide the best cutting performance for each application.
Export: Worldwide
D |
50-60 |
60-76.2 |
77-101.6 |
102-125 |
125-153 |
T |
|
|
|
|
|
0.07 |
Yes |
|
|
|
|
0.1 |
Yes |
Yes |
Yes | Yes |
|
0.2 |
Yes |
Yes |
Yes |
Yes |
|
0.3 |
Yes |
Yes |
Yes |
Yes |
|
0.4 |
Yes |
Yes |
Yes |
Yes |
Yes |
0.5 |
Yes |
Yes |
Yes |
Yes | Yes |
1.0 |
Yes |
Yes |
Yes |
Yes | Yes |
1.5 |
Yes |
Yes |
Yes |
Yes | Yes |
2.0 |
|
Yes |
Yes |
Yes | Yes |
H |
25.4, 31.75, 40, 52, 69.875, 88.9, 114.3 |
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